this is information on a product in full production. october 2012 doc id 018563 rev 2 1/7 7 STTH802-Y automotive ultrafast recovery diode datasheet ? production data features very low conduction losses negligible switching losses low forward and reverse recovery time high junction temperature aec-q101 qualified description the STTH802-Y uses st's new 200 v planar pt doping technology, and is specially suited for switching mode base drive and transistor circuits. packaged in dpak, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection for automotive application. table 1. device summary i f(av) 8 a v rrm 200 v t j (max) 175 c v f (typ) 0.8 v t rr (typ) 17 ns nc a k k a dpak stth802by-tr www.st.com
characteristics STTH802-Y 2/7 doc id 018563 rev 2 1 characteristics to evaluate the conduction losses use the following equation: p = 0.73 x i f(av) + 0.021 i f 2 (rms) table 2. absolute ratings (limiting values at t j = 25 c, unless otherwise specified) symbol parameter value unit v rrm repetitive peak reverse voltage 200 v i f(rms) forward rms current 16 a i f(av) average forward current, ? = 0.5 t c = 145 c 8a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 100 a t stg storage temperature range -65 to + 175 c t j operating junction temperature range -40 to + 175 c table 3. thermal parameters symbol parameter value unit r th(j-c) junction to case 3.2 c/w table 4. static electrical characteristics symbol parameter test conditions min. typ. max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm 6 a t j = 125 c 6 60 v f (2) forward voltage drop t j = 25 c i f = 8 a 0.95 1.05 v t j = 150 c 0.8 0.90 1. pulse test: t p = 5 ms, ? < 2% 2. pulse test: t p = 380 s, ? < 2% table 5. dynamic characteristics symbol parameter test conditions min. typ. max. unit t rr reverse recovery time i f = 1 a, di f /dt = -50 a/s, v r = 30 v, t j = 25 c 25 30 ns i f = 1 a, di f /dt = -100 a/s, v r = 30 v, t j = 25 c 17 22 i rm reverse recovery current i f = 8 a, di f /dt = -200 a/s, v r = 160 v, t j = 125 c 5.5 7 a t fr forward recovery time i f = 8 a, di f /dt = 50 a/s v fr = 1.1 x v fmax , t j = 25 c 150 ns v fp forward recovery voltage i f = 8 a, di f /dt = 50 a/s, t j = 25 c 1.5 v
STTH802-Y characteristics doc id 018563 rev 2 3/7 figure 1. peak current versus duty cycle figure 2. forward voltage drop versus forward current (typical values) figure 3. forward voltage drop versus forward current (maximum values) figure 4. relative variation of thermal impedance, junction to case, versus pulse duration figure 5. junction capacitanceversus reverse applied voltage (typical values) figure 6. reverse recovery charges versus di f /dt (typical values) 0 20 40 60 80 100 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 i m (a) t d =tp/t tp i m t =tp/t tp i m p = 2 w p = 2 w p = 1 w p = 1 w p = 5 w p = 5 w t j =25c t j =150c v fm (v) 0 20 40 60 80 100 120 140 160 180 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 i fm (a) t j =25c t j =150c v fm (v) 0.1 1.0 1.e-03 1.e-02 1.e-01 1.e+00 z th(j-c) /r th(j-c) single pulse tp(s) 10 100 1 10 100 1000 c(pf) f=1mhz v osc =30mv rms t j =25c v r (v) 0 20 40 60 80 100 120 140 160 10 100 1000 q rr (nc) i f =8a v r =160v t j =125c t j =25c di f /dt(a/s)
characteristics STTH802-Y 4/7 doc id 018563 rev 2 figure 7. reverse recovery time versus di f /dt (typical values) figure 8. peak reverse recovery current versus di f /dt (typical values) 0 10 20 30 40 50 60 70 80 10 100 1000 t rr (ns) i f =8a v r =160v t j =125c t j =25c di f /dt(a/s) 0 2 4 6 8 10 12 10 100 1000 i rm (a) i f =8a v r =160v t j =125c t j =25c di f /dt(a/s) figure 9. dynamic parameters versus junction temperature figure 10. thermal resistance, junction to ambient, versus copper surface under tab 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 25 50 75 100 125 150 q rr ;i rm [t j ]/q rr ;i rm [t j =125c] i rm q rr i f =8a v r =160v t j (c) 0 10 20 30 40 50 60 70 80 90 100 0 2 4 6 8 101214161820 s(cm2) rth (cw) (j-a) epoxy printed board copper thickness = 35 m
STTH802-Y package information doc id 018563 rev 2 5/7 2 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 11. footprint (dimensions in mm) table 6. dpak dimensions ref. dimensions millimeters inches min. max. min. max. a 2.20 2.40 0.086 0.094 a1 0.90 1.10 0.035 0.043 a2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b2 5.20 5.40 0.204 0.212 c 0.45 0.60 0.017 0.023 c2 0.48 0.60 0.018 0.023 d 6.00 6.20 0.236 0.244 e 6.40 6.60 0.251 0.259 g 4.40 4.60 0.173 0.181 h 9.35 10.10 0.368 0.397 l2 0.80 typ. 0.031 typ. l4 0.60 1.00 0.023 0.039 v2 0 8 0 8 h l4 g b l2 e b2 d a1 r r c a c2 0.60 min. v2 a2 6.7 6.7 3 3 1.6 1.6 2.3 2.3
ordering information STTH802-Y 6/7 doc id 018563 rev 2 3 ordering information 4 revision history table 7. ordering information order code marking package weight base qty delivery mode stth802by-tr stth802y dpak 0.3 g 2500 tape and reel table 8. document revision history date revision changes 10-mar-2011 1 first issue. 24-oct-2012 2 updated operating temperature range in ta b l e 2 .
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